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Thick copper plate process solution
Product Introduction and Process Features
Thick copper plates are mainly high current substrates, which are generally high-power or?high-voltage substrates. They are commonly used in automotive electronics,?communication equipment, aerospace, network energy, planar transformers, power?converters, and secondary power modules. The development of thinness and?miniaturization in electronic products urgently requires PCBs to have higher thermal?conductivity, and the application of thin core thick copper multilayer boards is more?widespread. The advantages of thick copper: Thick copper plates (≥ 3oz) have the ability?to carry large currents, reduce thermal strain, and have good heat dissipation.
Etching usually?involves etching?twice
Special pressing?program for?pressing
Special resin filling treatment?is required for 8oz or above?(inclusive)
Welding prevention?requirementsLine?Mask Design
Characteristics of Thick Copper Process
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Jiangxi Business Department：?
Tel：+86 0796 8616 983?
Email：wlgpcb@welgaopcb.com?
Email：ad-m@welgaopcb.com?
Email：wm.song@welgaopcb.com?Address: Nong Nam Som, Uthai,?Phra Nakhon Si Ayutthaya 13210?
Address: No. 1, Yongjin Avenue, Jinggangshan Economic?and Technological Development Zone, Ji'an City, Jiangxi?Province?
Address: No. 116, Jianshe Road, Longyuan Industrial Park,?Mabei Town, Boluo County, Huizhou City, Guangdong Province?
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